psc vishay electro-films document number: 61050 for technical questions, contact: efi@vishay.com www.vishay.com revision: 28-sep-09 1 rf spiral inductor for wire bonded assemblies psc series rf spiral inductors are designed for rf circuits that require wire bondable components. high precision equivalent circuit modeling enables accurate computer simulation of component performance. additional values and form factors available upon request. features ? wire bond assembly ? small size: 45 mils x 45 mils x 10 mils ? low dcr, high q ? low parasitic capacitance, high srf applications ? rf choking for dc biasing ? rf tuning circuits ? lumped element filters notes (1) main source of value tolerance is due to variat ion in wire bonds. see ?tex t fixture? section below. (2) bond pad geometry can be modified upon request. note (1) including the added inductance and resistance of typi cal bond wires. see equivalent circuit section. standard specifications parameter specifications substrate material alumina 99.6 % conductor material gold conductor thickness 5 m 10 % inductance range 1 nh to 100 nh tolerance (1) 20 % maximum power handling 250 mw operating temperature - 55 c to + 125 c storage temperature - 55 c to + 125 c bond pad diameter (2) 6 mil rf characteristics part number inductance value (nh) dcr ( ) in-circuit inductance value (nh) (1) in-circuit dcr ( ) (1) q srf (ghz) 250 mhz 1000 mhz 250 mhz 1000 mhz psc3500c 3.5 3.5 0.26 6 0.36 8 14 10.2 psc1050b 10.5 10.5 0.9 12 1 10 16 5.5 psc1250b 12.5 12.5 0.9 15 1 12 18 5.0 psc1800b 18 18 1.25 20.5 1.35 13 15 4.2 psc4500b 45 50 3.4 47.5 3.5 13 8 2.4
psc vishay electro-films rf spiral inducto r for wire bonded assemblies www.vishay.com for technical questions, contact: efi@vishay.com document number: 61050 2 revision: 28-sep-09 equivalent circuit the inductor?s spiral trace presents a substantial amount of se ries resistance, and the close spacing of the spiral turns prese nts measurable amounts of stray capacitance that interact with the inductive characteristics. a useful tool commonly used to model the be havior of electronic components at high fr equency is the equivalent circuit model. while the equivalent circuit model accurately predicts the reacti ve part of the total impedance, it fails to determine the real part of the response at high frequency. this is due to the fact that the model does not include skin and proximity effects that significantly increase the real part of the impedance as the frequency rises. fig. 1 - equivalent circuit the equivalent circuit values are presented in the table below: note (1) typical bond wires are approx imated as being 1.25 mil in diameter gold, totaling a length of 3 mm. the resistance listed above includes the added effect of the bond wire adhesion to the substrate and component. dimensions in inches [millimeters] length width thickness bond pad diameter 0.045 0.002 [1.143 0.051] 0.045 0.002 [1.143 0.051] 0.010 0.001 [0.254 0.0254] 0.006 [0.152] 0.045 0.006 global part number information global part number: psc4000cl4a1gnhw1 global part number description: psc 4 nh 25 % 45 x 45 x 10 au none h w1 model inductance (nh) inductance multiplier code tolerance code size substrate thickness (mil) termination back metal test class pac k ag i n g code psc the first 4 digits are significant figures of inductance c = 0.001 b = 0.01 a = 0.1 m = 20 % l = 25 % 4 = 45 x 45 a = alumina 1 = 10 g = au g = au n = none h = class h k = class k w1 = waffle pack, 1 min, 1 mult ts = tape and reel 100 min, 1 mult c bond w ire spiral ind u ctor l: desired ind u ctance r: parasitic self resistance c: parasitic sh u nt capacitance r bw : bond w ire self resistance l bw : parasitic b ond w ire ind u ctance r bw l bw lr equivalent circuit model 2 inductance value l (nh) dcr r ( ) shunt cap. c (ff) typ. r bw (1) ( ) typ. l bw (1) (nh) 3.5 0.26 71 0.1 2.5 10.5 0.9 80 0.1 2.5 12.5 0.9 81 0.1 2.5 18 1.25 84 0.1 2.5 45 3.4 92 0.1 2.5 4000 l4a c c ps 1g n hw 1
psc rf spiral inductor for wire bonded assemblies vishay electro-films document number: 61050 for technical questions, contact: efi@vishay.com www.vishay.com revision: 28-sep-09 3 component performance fig. 2 - relative impedance vs. frequency layout considerations the rf spiral inductor is electrically c onnected to the circuit by wire bonds. all wire bonds add parasitic inductance and resistance, as shown in figure 1. it is important to note that se tup variations might affect the performance of t he component. special care must be given to mini mize these effects by careful design of the component host ci rcuit board. the following aspects should be considered: ? bond wire length should be minimized. the bond wire added in ductance can be roughly estimated at 0.75 nh per mm of 1.25 mil diameter gold wire. ? any ground plane directly under the component will increase th e parasitic shunt capacitance. this will cause self-resonance at lower frequencies. ? the epoxy used to attach the component is the limiting factor in power handling. for applicat ions that require high power handling it is recommended to use high temperat ure epoxy and to ensure adequate heat sinking. 10 1000 100 10 000 fre qu ency (mhz) 0.9 2.1 a b s (z)/z 0 3.5 nh 2.0 1.9 1. 8 1.7 1.6 1.5 1.4 1.3 1.2 1.0 1.1 10.5 nh 12.5 nh 45 nh 1 8 nh
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